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  5. Engineering: Cornell Quarterly, Vol.28, No.1 (Autumn 1993): The Electronic Packaging Program

Engineering: Cornell Quarterly, Vol.28, No.1 (Autumn 1993): The Electronic Packaging Program

File(s)
1993_v28_n1.pdf (33.12 MB)
Permanent Link(s)
https://hdl.handle.net/1813/2459
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Engineering Quarterly
Author
Ober, Christopher K.
Stoffel, Nancy C.
Russell, Michael W.
Kraus, Gerald T.
Giannelis, Emmanuel P.
Li, Che-Yu
Avedisian, C. Thomas
Torrance, Kenneth E.
Krusius, J. Peter
Abstract

IN THIS ISSUE: The Electronic Packaging Program /2 (The ongoing miniaturization of electronic products challenges engineers to find better ways of putting them together.) ... The Importance of Polymers in Packaging /4 (The advantages of polymers make them indispensable in electronic packaging; overcoming their shortcomings makes for challenging research.) ...Spin-On Oxides for Microelectronics /9 (A technique developed for preparing photoresists can be used to make thin films of high-dielectric-constant oxides for capacitors.) ... Thermal Management of Electronic Packages /20 (Electronic circuits can be damaged by the heat they generate, so thermal engineers are on the case.) ... Dependable Connections: Getting the Signal In and Out /14 (Careful testing improves technologies for making reliable connections between dense arrays of very small contacts.) ... Simulating System Constraints in Computer Packaging /26 (A simulation program makes it possible to compare different packaging options without having to build real prototypes.) ... Register /31 (Three new members join the faculty, six retire.) ... Faculty Publications /36

Date Issued
1993
Publisher
Internet-First University Press
Keywords
Engineering
•
Cornell University
•
Electronic Packaging
•
Polymers
•
Oxides
•
Microelectronics
•
Thermal Engineering
•
Computer Packaging
Type
periodical

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